NORDSON MARCH StratoSPHERE (For Wafer)
MARCH StratoSPHERE
Description：
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- Footprint: 1405W x 2615D x 1742H mm
- Working Area: 305W x 560D mm
- RF Power: 600W
- Frequency: 13.56MHz
- MFCs: Up to 4
- Pump: Dry pump, 16CFM
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- Wafer processing prior to fan-out, wafer-level packaging, 3D packaging, flip-chip, and traditional packaging.
- Capable of handling wafers up to 300 mm (12 inches) with excellent etching uniformity.
- Fully automated LUL system
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Specifications
- Footprint: 1405W x 2615D x 1742H mm
- Working Area: 305W x 560D mm
- RF Power: 600W
- Frequency: 13.56MHz
- MFCs: Up to 4
- Pump: Dry pump, 16CFM
-
Applications
- Wafer processing prior to fan-out, wafer-level packaging, 3D packaging, flip-chip, and traditional packaging.
- Capable of handling wafers up to 300 mm (12 inches) with excellent etching uniformity.
- Fully automated LUL system
Product storage：0
